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Copper acetate and the ligands bis[3-(3-tert-butyl-2-hydroxy-5-methoxybenzylideneamino)phenyl] sulfone and bis[3-(3,5-di-tert-butyl-2-hydroxybenzylideneamino)phenyl] sulfone were reacted to form the complexes with 2:1 copper:ligand ratio, Cu2[B(t-Bu) (OMe)BAPS](µ-OCH3)2 (4) and with 2:2 copper:ligand ratio, Cu2[B(t-Bu)2BAPS]2 (5), respectively. Structures of 4 and 5 were determined based on IR, UV-Vis, and FAB-MS data in comparison with previously characterized related copper complexes. The two complexes 4 and 5 were utilized in the oxidation of the substrates 2,4- and 2,6-di-tertbutylphenol (dtbp) at -50C with H2O2 in CH2Cl2. The coupling products are preferred in both cases. For 2,4-dtbp, yields of 4,600% and 7,200% of 3,3’,5,5’-tetra-tert-butyl-2,2’- biphenol were achieved with the use of 4 and 5, respectively. For 2,6-dtbp, yields of 1,900% and 400% of 3,3’,5,5’-tetra-tert-butyl-4,4’-biphenol were realized utilizing 4 and 5, respectively. These show that the methoxy groups activated the complex. Based on low temperature UV-vis results, a µ-η2 :η2-peroxo or a µ-hydroperoxo intermediate was possibly formed by the reaction of 4 with the H2O2. This effected the oxidation of the 2,4- and 2,6- dtbp substrates but also resulted in the attack of other complexes which acted as substrates. A proposed oxidation mechanism using complex 4 and related complexes is presented.